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Filler Dispersion Product List

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Electric control filler dispersion liquid

Electric control filler dispersion liquid

We offer a wide range of products from low to high surface resistance values!

This document introduces electrically controlled filler dispersions. It includes a product lineup featuring "MHI Black #RK-034," "MHI Black #273," and "MHI Black #RK-045," as well as results from measurements of surface resistance values obtained by varying pigment concentrations in the coating film, presented in tables. We control conductivity to solve challenges. We invite you to read it. 【Contents】 ■ Product lineup of electrically controlled fillers ■ Product lineup of electrically controlled filler dispersions ■ High-resistance CB dispersions ■ Introduction of new items under consideration *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Introduction of thermal conductive filler dispersion liquid.

Introduction of thermal conductive filler dispersion liquid.

Improved hand-linking properties, reduced foreign matter due to miniaturization, and additional performance enhancements!

This document introduces a "thermal conductive filler" dispersion. The main applications of thermal conductive fillers include their use in molded products such as heat sinks and heat dissipation substrates. By slurrying thermal conductive ceramics, the potential for use in "thermal conductive adhesives, paints, films, coatings, and sheets" is expanded. The document provides detailed information on the various properties of thermal conductive fillers, including a dispersion of spherical alumina nanoparticles, using diagrams and photographs. We encourage you to read it. [Contents (partial)] ■ Applications of thermal conductive fillers ■ Properties of thermal conductive fillers ■ Dispersion of spherical alumina nanoparticles ■ Boron nitride dispersion ■ Flaky boron nitride dispersion ■ Spherical nanoparticle boron nitride dispersion (development product) *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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High concentration low dielectric constant filler dispersion.

High concentration low dielectric constant filler dispersion.

We offer a "high-concentration low-dielectric constant filler dispersion" that is highly dispersed with spherical silica and spherical boron nitride nanoparticles.

Spherical silica is often used as a filler to protect electronic materials, particularly semiconductors, and by using special spherical silica, we are able to implement "low dielectric constant." Additionally, boron nitride is well-known for its excellent thermal conductivity, but it also possesses excellent insulation and low dielectric constant. Since hexagonal boron nitride is in the form of spherical nanoparticles rather than flakes, it is expected to provide heat dissipation without the need for controlling anisotropy, in addition to having a low dielectric constant. Customization is available according to your needs (such as improving compatibility with target materials or changing solvents).

  • Composite Materials

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Media various functional filler dispersion liquid

Media various functional filler dispersion liquid

What are various functional filler dispersion liquids (development products) for UV cationic/anionic/frontal polymerization epoxy/oxetane/vinyl ether media?

Thermosetting resins such as epoxy resins are commonly used for adhesives and sealants in electrical and electronic applications, but the majority of these cure through heat, which limits the range of applications. In addition to thermal curing reactions, epoxy resins have long been polymerized through cationic UV curing. Recently, with the development of excellent photobase generators, anionic UV curing and frontal UV curing have also been put into practical use. Furthermore, oxetanes can be synthesized through ring-opening polymerization caused by acids generated during cationic UV curing. Cationic/anionic/frontal polymerization offers faster curing compared to thermosetting and achieves comparable physical properties. Additionally, it has advantages such as being unaffected by oxygen inhibition like radical polymerization and having a low shrinkage rate. It is also possible to cure deep within thick films.

  • Composite Materials

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Liquid glycol/polyol medium various functional filler dispersion liquid

Liquid glycol/polyol medium various functional filler dispersion liquid

We provide products that uniformly disperse various functional fillers in liquid diols/polyols using a monomer as the medium.

Features: - Various functional fillers are uniformly dispersed in a liquid diol/polyol medium, and stability over time is also good. - By using a dispersion of various functional fillers in a liquid diol/polyol medium for reactions (curing) with isocyanates, it becomes possible to design various solvent-free functional materials.

  • Composite Materials

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